View MAS6501BA1ST206_4623038.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DA6501.001 27 October 2008
MAS6501
This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice.
16-Bit Analog-to-Digital Converter
* Standby Current Consumption 0.1 A * Low Supply Current * Low Power Consumption * Resolution 16 Bits * Ratiometric ADC * ENOB 14 Bits * Serial Data Output (I2C bus)
DESCRIPTION
The MAS6501 is a 16 bit Analog-to-Digital Converter (ADC), which employs a delta-sigma () conversion technique. With the linear input signal range of 282 mVPP its resolution is 14 bits. The MAS6501 is designed especially to meet the requirement for low power consumption, thus making it an ideal choice for battery powered systems. The MAS6501 is equipped with a standby function, i.e. the ADC is in power down between each conversion. By utilizing this and overall low power consumption, current consumption values of 1.6 A (one pressure conversion in a second with full 14-bit accuracy) or less can be achieved. The MAS6501 has an on-chip second order decimator filter to process the output of the second order -modulator. The ADC also has two selectable conversion ranges with two optional offset levels. 2 A bi-directional 2-wire I C bus is used for configuring conversion parameters, starting conversion and reading out the A/D conversion result. MAS6501 has one input channel suitable for piezo resistive pressure sensor. In addition to pressure measurement configuration the device can be configured to temperature measurement.
FEATURES
* * * * * * * * * * * Low Standby Current Consumption 0.1 A Typ Low Supply Current: 0.2 A..1.6 A Supply Voltage: 2.0 V...3.6 V Ratiometric Conversion Two Input Signal Ranges (VDD=2.35V): 325 mVPP , 98 mVPP Two Optional Offsets (VDD=2.35V): 123 mV, 33 mV Over Sampling Ratio: 512, 256, 128, 64 Conversion Times 32.2 ms...2.5 ms In Fast Mode: Over Sampling Ratio 64, Conversion Time 2.5 ms, Resolution 10 Bits Good Noise Performance due to Architecture 2 2-Wire I C Interface
APPLICATIONS
* * * * * Battery Powered Systems Low Frequency Measurement Applications Pressure and Temperature Measurement Current/Power Consumption Critical Systems Industrial and Process Control Applications in Noisy Environments
I2C is a registered trademark of Philips Inc.
1 (16)
DA6501.001 27 October 2008
BLOCK DIAGRAM
VDD
PI NI COMMON
S&H ADC DIG FIL DIG INT EOC SDA SCL XCLR
GND
MCLK
Figure 1. MAS6501 block diagram
ABSOLUTE MAXIMUM RATINGS
All Voltages with Respect to Ground
Parameter Supply Voltage Voltage Range for All Pins Latchup Current Limit
Symbol VCC
Conditions During conversion No conversion For all pins, test according to Micro Analog Systems specification ESQ0141. See note below.
Min - 0.3 - 0.3 - 0.3 - 100
Max 3.8 6.0 VIN + 0.3 + 100
Unit V V mA
ILUT
Junction Temperature Storage Temperature
TJmax TS
- 55
+ 175 +125
C C
Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed. Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages (ESD). Note: In latchup testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed to each input separately and device current consumption is observed. If the device current consumption increases suddenly due to test current pulses and the abnormally high current consumption continues after test current pulses are cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms.
RECOMMENDED OPERATION CONDITIONS
Parameter Supply Voltage Operating Temperature Symbol VCC TA Conditions Min 2.0 -20 Typ 2.35 +25 Max 3.6 +60 Unit V C
The device performance may deteriorate in the long run if the Recommended Operation Conditions limits are continuously exceeded.
2 (16)
DA6501.001 27 October 2008
ELECTRICAL CHARACTERISTICS
TA = -20oC to +60oC, Typ TA = 25oC, VDD = 2.35 V, Rsensor = 4.5k unless otherwise noted
Parameter Average ADC Current during Conversion Time (see Conversion Time at bottom) Average ADC Current in Pressure and Temperature Measurement during Conversion Period (no sensor current included)
Symbol ICONV
Conditions Max value at VDD = 3.6 V
Min
Typ 30
Max 50
Unit A
IADC
Average Supply Current in Pressure Measurement during Conversion Period (including sensor bridge current)
ISAVG_P
Average Supply Current in Temperature Measurement (including sensor bridge current)
ISAVG_T
Peak Supply Current During Pressure Measurement Peak Supply Current During Temperature Measurement Standby Current Conversion Time
ISC ISC ISS tCONV
1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 k, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 k, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 k, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 VDD = 2.35 V, Rsensor = 4.5 k VDD = 2.35 V, Rsensor = 4.5 k VDD = 2.35 V MCLK = 32768 Hz, XENMCLKDIV=1 OSR=512 OSR=256 OSR=128 OSR=64
0.5 0.25 0.13 0.07
0.9 0.5 0.3 0.2
A
1.6 0.8 0.5 0.3
2.5 1.3 0.7 0.4
A
0.9 0.5 0.3 0.2 0.52
1.5 0.8 0.4 0.3
A
mA
0.19
mA
0.1
0.5
A
16.1 8.3 4.4 2.5
ms
Note: XENMCLKDIV refer to the I2C serial interface control bits, see table 1 on page 5.
3 (16)
DA6501.001 27 October 2008
ELECTRICAL CHARACTERISTICS
TA = -20oC to +60oC, Typ TA = 25oC, VDD = 2.35 V, Rsensor = 4.5k unless otherwise noted
Parameter Resolution
Symbol
Conditions ISR = 325 mV ISR = 98 mV ISRLIN = 282 mV, OSR = 512 ISRLIN = 85 mV, OSR = 512
Min
Typ 16 4.9 1.5 17 5.1 4 3 14 13 12 10 32768
Max
Unit Bit V V LSB LSB Bit
Accuracy Integral Nonlinearity Differential Nonlinearity ENOB (Effective Number of Bits) INL DNL
ISRLIN = 282 mV OSR=512 OSR=256 OSR=128 OSR=64 MCLK tDEL DUTYC SCL ISR ISRLIN MCLK = 32768 Hz 30000 0.1
External Clock Signal Delay Between End of Conversion and ADC Result Read-Out Duty Cycle of MCLK Serial Data Clock Input Signal Conversion Range Linear Input Signal Conversion Range Output Code Values Temperature Measurement Resistors
35000
Hz ms
Master Clock Division Enabled XENMCLKDIV=0 ISCR = 1 ISCR = 0 ISCR = 1 ISCR = 0
60/40
50/50
40/60 400
% kHz mV mV
325 98 282 85 0 -15% 7710 17000 3073 17000 -280 65152 +15%
Temperature Measurement Resistors Temp Coefficient
R1 R2 R3 R4 TCR
TBD
TBD
ppm / C
Note: ISCR refer to the I2C serial interface control bits, see table 1 on page 5. TBD = To Be Defined
4 (16)
DA6501.001 27 October 2008
MAS6501 CONTROL REGISTER
Table 1. MAS6501 control register bit description Bit Name Description Bit Number 7-6 OSRS(1:0) Over Sampling Ratio (OSR) selection Value 11 01 10 00 0 1 1 0 1 0 0 1 0 1 1 0 Function OSR = 512 OSR = 256 OSR = 128 OSR = 64 No Conversion Start Conversion Pressure configuration Temperature configuration 325 mV (282 mV linear range) 98 mV (85 mV linear range) MCLK division enabled MCLK division disabled Offset enabled Offset disabled +123 mV +33 mV
5 4 3 2 1 0
SCO PTS ISCR XENMCLKDIV XOSENABLE OSSELECT
Start Conversion Pressure/Temperature Selection Input Signal Conversion Range Enable Master Clock Division Enable offset Offset value selection
MAS6501 has one control register for configuring the measurement setup. See table 1 for control register bit definitions. Control register values are set via I2C bus. First two OSRS bits of the control register define four selectable over sampling ratios. The higher OSR the better ADC accuracy but the longer conversion time. The SCO bit controls the A/D conversion. When SCO = 0, no A/D conversion takes place. When SCO = 1, the A/D converter turns on and the analog data is being converted. Then MCLK must be clocked at least until EOC pin goes high indicating that conversion has been accomplished. PTS bit selects between pressure and temperature measurement. In temperature measurement the sensor is connected in bridge configuration together with four integrated resistors (see figure 3 on page 8 and resistors R1, R2, R3 and R4). ISCR selects between two A/D conversion ranges. The XENMCLKDIV bit controls the internal clock frequency of MAS6501, fCLK(INT). When the bit is
low, the MCLK division is enabled and the internal clock frequency fCLK(INT) = fMCLK/2, where fMCLK is the master clock frequency. When the XENMCLKDIV bit is high, the MCLK division is disabled and fCLK(INT) = fMCLK. In the XENMCLKDIV = 1 mode the duty cycle should be as close to 50 % as possible. In this mode, the conversion time is made half (see page 3 conversion time values with XENMCLKDIV = 1) compared to clock speed division mode XENMCLKDIV = 0 whereas the resolution remains unchanged. In XENMCLKDIV = 0 mode the conversion time and also current consumption are doubled but then the external master clock signal MCLK does not need to have close to 50% duty cycle. XOSENABLE can be used to enable input signal range offset option. At 1 value no offset is applied but at 0 value an offset value which is determined with OSSELECT bit is used. OSSELECT selects between two offset values. No offset is applied if offset is disabled (XOSENABLE=1).
5 (16)
DA6501.001 27 October 2008
2
I C SERIAL INTERFACE CONTROL
Serial Interface MAS6501 has two wire serial I2C bus type interface comprising of serial clock (SCL) and serial data (SDA) pins. I2C bus is used to write configuration data to sensor interface IC and read the measurement result when A/D conversion has been finished. Digital interface includes also master clock (MCLK), end of conversion (EOC) and master reset (XCLR) pins. MLCK signal is needed to be clocked during conversion period. It can be stopped after EOC goes high which indicates that A/D conversion has Device and Register Addresses I2C bus standard makes it possible to connect several I2C bus devices into same bus. The devices are distinguished from each other by unique device address codes. MAS6501 device address is shown Table 2. MAS6501 device address A7 A6 A5 A4 A3 A2 A1 1 1 1 0 1 1 1 in table 2. The LSB bit of the device address defines whether the bus is configured to Read (1) or Write (0) operation. been accomplished. MCLK signal can also be running all the time. XCLR is used to reset the A/D converter. Reset initializes internal registers and counters. After connecting supply voltage to MAS6501 and before starting operating the device via I2C bus it is required to reset the device with XCLR reset pin if supply voltage rise time has been longer than 400 ns. If the supply voltage rise time is shorter than this the external reset with XCLR pin is unnecessary since the device is automatically reset by power on reset (POR) circuitry.
W/R 0/1 Control register bits are described in table 1 (page 5). Two other 8-bit registers are used to store the 16-bit A/D conversion result.
MAS6501 contains three 8-bit registers which are presented in table 3. Control register is used to configure the device to proper measurement setup. Table 3. MAS6501 internal register addresses A7 A6 A5 A4 A3 A2 A1 A0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 1 1 0 1
Register Description MSB A/D Conversion Result Register LSB A/D Conversion Result Register Control register
6 (16)
DA6501.001 27 October 2008
I C SERIAL INTERFACE CONTROL...
I2C Bus Protocol Definitions Two wire I2C bus protocol has special bus signal conditions. Figure 2 shows start (S), stop (P) and binary data conditions. At start condition the SCL is high and SDA has falling edge. At stop condition the SCL is also high but SDA has rising edge. Data must be held stable in SDA pin when SCL is high. Data can change value at SDA pin only when SCL is low.
2
S
SDA SCL
1 0
P
Figure 2. I2C protocol definitions I2C contains also acknowledge (A) and not acknowledge (N) commands. At acknowledge the master device sends 0 bit to SDA bus (pulls down Abbreviations: A= Acknowledge by Slave N = Not Acknowledge by Master Conversion Starting - Write Sequence Conversion is started by first writing measurement configuration bits into the control register. Write sequence is illustrated in Table 4. Table 4. MAS6501 I2C bus write sequence bits S AW A AC A DC A P Abbreviations: AW = Device Write Address (%1110 1110) AR = Device Read Address (%1110 1111) AC = Control Register Address (%1111 1111) Ax = MSB (x=M, %1111 1101) or LSB (x=L, %1111 1110) ADC Result Register Address Each I2C bus operation like write starts with start command (see figure 2). After start the MAS6501 device address with write bit (AW, see table 2) is sent and ended to acknowledge (A). After this control register address (AC, see table 3) is sent A/D Conversion A/D conversion is progressed by running MCLK signal until EOC goes high indicating that conversion is done and data is ready for reading. To start conversion the control register SCO bit has to be set high (SCO=1, see control register bit description in table 1). SDA) for one SCL clock cycle. At not acknowledge (N) the slave device sends 0 bit to SDA (pulls down SDA) for one SCL clock cycle. S = Start P = Stop
DC = Control Register Data Dx = MSB (x=M) or LSB (x=L) A/D Result Register Data
and ended to acknowledge (A). Next control register data (DC, see table 1) is written and ended to acknowledge (A). Finally the I2C bus operation is ended with stop command (see figure 2).
7 (16)
DA6501.001 27 October 2008
I C SERIAL INTERFACE CONTROL...
Conversion Result - Read Sequence Table 5 presents general control sequence for single register data read. Table 5. MAS6501 I2C bus single register (address Ax) read sequence bits S AW A Ax A S AR A Dx N P Table 6 presents control sequence for reading the 16-bit A/D conversion result from both MSB and LSB data registers. LSB register data (DL) can be read right after MSB register data (DM) read since in case the read sequence is continued (not ended to stop condition P) the register address is automatically incremented to point to next register address (in this case to point to the LSB data register).
2
Table 6. MAS6501 I2C bus MSB (first) and LSB (second) A/D conversion result read sequence S AW A AM A S AR A DM N DL N P Accuracy Improvement - Averaging Averaging technique can be used to remove conversion error caused by noise and thus improve measurement accuracy. By accomplishing several A/D conversions and taking average of the samples it is possible to average out noise. Theoretically noise is reduced by factor N where N is number of averaged samples. A/D converter nonlinearities cannot be removed by averaging.
8 (16)
DA6501.001 27 October 2008
APPLICATION INFORMATION
+ CVDD
VDD
GND
R1
SENSOR PI
Input MUX
P P T
Control ADC Dig. filter
MCLK EOC SDA
NI
T
IC Serial Interface
2
SCL
XCLR
R3
COMMON
R4
P T
R2
T
MAS9185 MAS6501
GND
GND
Figure 3. Resistive sensor connection circuit Together with a resistive pressure sensor, MAS6501 can be used in pressure measurement applications. Control can be performed with a micro2 controller through the I C serial interface. The sensor is connected between the power supply voltage (VDD) and MAS6501 signal ground (COMMON) which can be internally (switch inside of MAS6501) connected to ground (GND). Sensor output is read as a differential signal through PI (positive input) and NI (negative input) to the converter in MAS6501. In the pressure measurement mode, the switches marked "P" are closed and the sensor output is fed through to the ADC. In the temperature measurement mode, the switches marked "T" are closed and the voltage at the ADC input is determined by the internal resistor array and the temperature-dependent resistance of the sensor. In this configuration the sensor bridge is connected as part of single four resistor bridge circuit where other four resistors (R1, R2, R3, R4) are inside the IC. To guarantee conversion accuracy a supply voltage decoupling capacitor of 4.7 F or more should be placed between VDD and GND of MAS6501 (see CVDD in figure 3).
9 (16)
DA6501.001 27 October 2008
MAS6501 PAD LAYOUT
1740 m
PI
TE2
GND
COMMON
TE1 SCL
Y-coordinate -839 m -839 m -839 m -839 m -839 m -839 m 839 m 839 m 839 m 839 m 839 m 839 m
NI
6501
MCLK
XCLR
EOC
VDD
Die dimensions 1740 m x 2090 m; round PAD 80 m Note: Because the substrate of the die is internally connected to GND, the die has to be placed over a GND plate on PCB or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in the center of the silicon die. Pad Identification Name X-coordinate -713 m -450 m -200 m -18 m 318 m 726 m -713 m -450 m -200 m -18 m 318 m 726 m
End of Conversion EOC Power Supply VDD Master Clock MCLK Clear I2C, Stop Conversion XCLR Serial Bus Data Input/Output SDA Serial Bus Clock SCL Supply Ground GND Sensor Ground COMMON ADC Positive Input PI Test Pin 2 TE2 ADC Negative Input NI Test Pin 1 TE1 Note: Test pins TE1 and TE2 must be left floating.
6501
SDA
2090 m
10 (16)
DA6501.001 27 October 2008
SAMPLES IN SBDIL 20 PACKAGE
PI 1 COMMON 2 GND 3 NC 4 NC 5 NC 6 NC 7 NC 8 EOC 9 VDD 10
PIN DESCRIPTION Pin Name PI COMMON GND Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Type AI AI G NC NC NC NC NC DO P DI DI DI/O DI NC NC NC DI/O AI DI Function ADC Positive Input Sensor Ground Supply Ground Notes
MAS6501xx YYWW XXXXX.X
20 TE2 19 NI 18 TE1 17 NC 16 NC 15 NC 14 SCL 13 SDA 12 XCLR 11 MCLK Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number xx = Sample Version
EOC VDD MCLK XCLR SDA SCL
End of Conversion Power Supply Master Clock Clear I2C, Stop Conversion Serial Bus Data Input/Output Serial Bus Clock
TE1 NI TE2
Test Pin 1 ADC Negative Input Test Pin 2
Pin must be left floating Pin must be left floating
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
11 (16)
DA6501.001 27 October 2008
PIN CONFIGURATION & TOP MARKING FOR PLASTIC TSSOP-16 PACKAGE
EOC VDD MCLK XCLR SDA SCL
GND
6501zz
COMMON PI TE2 Top Marking Definitions: NI zz = Version TE1
YYWW
YYWW = Year Week
PIN DESCRIPTION
Pin Name EOC VDD MCLK XCLR SDA SCL TE1 NI TE2 PI COMMON GND Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type NC DO P DI DI DI/O DI NC DI/O AI DI AI AI NC G NC Function End of Conversion Power Supply Master Clock Clear I2C, Stop Conversion Serial Bus Data Input/Output Serial Bus Clock Test Pin 1 ADC Negative Input Test Pin 2 ADC Positive Input Sensor Ground Supply Ground Pin must be left floating Pin must be left floating Note
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
12 (16)
DA6501.001 27 October 2008
PACKAGE (TSSOP-16) OUTLINES
C
E D Seating Plane B A O Pin 1 Detail A F G H
B B
L I I1 K P Section B-B J1 J M N
Detail A
Dimension A B C D E F G H I I1 J J1 K L M (The length of a terminal for soldering to a substrate) N O P
Min 6.40 BSC 4.30 5.00 BSC 0.05 0.19 0.65 BSC 0.18 0.09 0.09 0.19 0.19 0 0.24 0.50
Max 4.50 0.15 1.10 0.30 0.28 0.20 0.16 0.30 0.25 8 0.26 0.75
Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm
1.00 REF 12 12
mm
Dimensions do not include mold flash, protrusions, or gate burrs. All dimensions are in accordance with JEDEC standard MO-153.
13 (16)
DA6501.001 27 October 2008
SOLDERING INFORMATION
N For Pb-Free, RoHS Compliant TSSOP-16 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 260C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 m, material Matte Tin
EMBOSSED TAPE SPECIFICATIONS
Tape Feed Direction P0 D0 P2
A E1 F1 W
D1 A P A0 Tape Feed Direction T Section A - A B0 S1 K0
Dimension A0 B0 D0 D1 E1 F1 K0 P P0 P2 S1 T W Min 6.50 5.20 1.50 +0.10 / -0.00 1.50 1.65 7.20 1.20 11.90 4.0 1.95 0.6 0.25 11.70 2.05 0.35 12.30 1.85 7.30 1.40 12.10
Pin 1 Designator
Max 6.70 5.40 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm 14 (16)
DA6501.001 27 October 2008
REEL SPECIFICATIONS
W2
A
D B
Tape Slot for Tape Start
C
N
W1
2000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape
Cover Tape End
Start
Trailer
Dimension A B C D N W1 (measured at hub) W2 (measured at hub) Trailer Leader
Components
Min 1.5 12.80 20.2 50 12.4 Max 330 13.50
Leader
Unit mm mm mm mm mm mm mm mm mm
14.4 18.4
160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500
Weight
g
15 (16)
DA6501.001 27 October 2008
ORDERING INFORMATION
Product Code MAS6501BA1WA300 MAS6501BA1ST206 Product 16-Bit A/D-Converter 16-Bit A/D-Converter Description EWS-tested wafer, Thickness 400 m. TSSOP-16, Pb-free, RoHS compliant, Tape & Reel
Contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com
NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
16 (16)

▲Up To Search▲

Price & Availability of MAS6501BA1ST206

	To Download MAS6501BA1ST206 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .